TR7700 SIII DT是一臺高性能的離線型AOI解決方案，擁有精度高和易用性等優(yōu)點(diǎn)。使用TRI多相位光源和新一代的檢測軟件，TR7700 SIII DT具備快速和簡易編程等優(yōu)良的缺陷檢測功能，非常適合變化度高生產(chǎn)線。
特點(diǎn)● 為爐前/爐后檢測之精度高離線型AOI解決方案
● 快速、易編程且符合IPC標(biāo)準(zhǔn)規(guī)范
● 優(yōu)良的演算法和多相位光源將誤判降至最低.
規(guī)格：
| Optical System/光學(xué)系統(tǒng) | |
| Imaging Method/成像方法 | Dynamic Imaging/動(dòng)態(tài)成像 |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | N/A |
| Max. 3D Range | N/A |
| Inspection Performance/檢驗(yàn)性能 | |
| Imaging Speed | 4 Mpix@ 10 μm: 60 cm2/sec |
| 4 Mpix@ 12.5 μm: 120 cm2/sec | |
| Motion Table & Control/運(yùn)動(dòng)表和控件 | |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 μm |
| Board Handling/板處理 | |
| Max PCB Size | TR7700 SIII DT: 330 x 250 mm |
| TR7700L SIII DT: 510 x 460 mm | |
| PCB Thickness | 3 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm [48 mm optional] |
| Bottom Clearance | TR7700 SIII DT: 100 mm |
| TR7700L SIII DT: 50 mm | |
| Edge Clearance | 3 mm |
| Conveyor | Manual |
| Inspection Functions/檢查功能 | |
| Component | Missing |
| Tombstoning | |
| Billboarding | |
| Polarity | |
| Rotation | |
| Shift | |
| Wrong Marking (OCV) | |
| Defective | |
| Upside Down | |
| Extra Component | |
| Foreign Material | |
| Solder | Excess Solder |
| Insufficient Solder | |
| Bridging | |
| Through-hole Pins | |
| Lifted Lead | |
| Golden Finger | |
| Scratch/Contamination | |
| Dimensions/尺寸 | |
| WxDxH | TR7700 SIII DT: 860 x 1100 x 1350 mm |
| TR7700L SIII DT: 980 x 1345 x 1490 mm | |
| Weight | TR7700 SIII DT: 340 kg |
| TR7700L SIII DT: 385 kg | |
蘇公網(wǎng)安備 32058302003152號